Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year | Nachrichten Heute – Aktuelle News aus Deutschland & der Welt

Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year

Quelle: TomsHardware.de - 6 Tagund Vor


Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom AI ASICs.